LG Innotek Launches Advanced AP Module for Automotive Sector

Seoul, South Korea—LG Innotek has introduced a new automotive application processor module into the global automotive semiconductor component market. 

The company plans to expand its electronic components business into the automotive semiconductor sector.

The AP modules are semiconductors that integrate and control vehicle electronic systems, such as Advanced Driver Assistance Systems and digital cockpits. 

They function similarly to a computer's central processing unit.

Industry estimates indicate that the number of AP module installations in vehicles will grow 22% annually, from 33 million units in 2025 to 113 million by 2030. 

The growth is driven by increasing data processing requirements that exceed the capabilities of traditional PCB-based semiconductor chips.

The LG Innotek module measures 2.5 inches by 2.5 inches and contains over 400 components, including memory semiconductors, Power Management Integrated Circuits, and integrated chipsets. 

These components control data processing, graphics processing, display output, and multimedia functions.

The compact design reduces motherboard size and improves control performance by shortening the signal distance between components. 

LG Innotek plans to enhance the module's heat dissipation to operate at temperatures up to 95°C and reduce development time through virtual simulation.

The company promotes the product to semiconductor companies in North America and other regions. 

Mass production is targeted for the second half of 2025.

LG Innotek aims to grow its semiconductor components business to $3 billion in annual sales by 2030 through high-value products, including FC-BGA, RF-SiP, and Automotive AP modules.