SK hynix Unveils Advanced Heat-Dissipating Mobile DRAM

Seoul, South Korea — SK hynix Inc. said Thursday it has begun supplying mobile DRAM products that use a High-K Epoxy Molding Compound, which the company described as the first such material deployed in the industry.

The company said the material increases thermal conductivity by 3.5 times and reduces vertical thermal resistance by 47 percent compared with existing materials.

The technology is designed to address heat generation in smartphones that process on-device artificial intelligence applications, according to SK hynix.

The company developed the High-K EMC by adding alumina to silica, the standard material used in semiconductor packaging.

Epoxy molding compounds protect semiconductor chips from moisture, heat, impact and electrical charges while allowing heat dissipation.

The material is intended to address thermal issues in Package on Package systems used in flagship smartphones, where DRAM components are stacked atop application processors.

This design saves space and increases data transfer speeds, but can lead to heat from processors accumulating in DRAM components, which may reduce performance.

The company said the technology is expected to improve battery life and device durability by reducing power consumption and enhancing performance.

Smartphone manufacturers anticipate the technology may help address heat issues in high-performance devices running AI applications that require fast data transfer, according to SK hynix.

“It’s a meaningful achievement that goes beyond simple performance improvement, as it addresses issues faced by many high-performance smartphone users,” said Lee Gyujei, head of package product development at SK hynix.

SK hynix said it plans to use the technology to compete in next-generation mobile DRAM markets.

Package on Package refers to a method of stacking different chip types vertically to optimize space, performance and design options in mobile devices.

Mobile application processors handle computing tasks in smartphones and tablets.