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Furiosa AI and Hugging Face collaborate to advance next-gen AI semiconductors.

Source: Furiosa AI

Furiosa AI, a semiconductor startup, has partnered with Hugging Face, a global AI platform. The two companies will work together to promote the development of next-generation AI semiconductors.

Joint solutions will be designed to optimize and effectively serve transformational AI models in various fields, including speech, vision, and ultra-large language models like ChatGPT.

In time for the launch of Furiosa AI’s next-generation AI semiconductor, the two companies aim to collaborate with global AI companies.

The semiconductor will be equipped with the third-generation high-bandwidth memory D-RAM “HBM3”, which is capable of processing large amounts of data at the same time.

The design of the next-generation AI semiconductor has now been completed, and mass production is expected to start in 2024.

The partnership between the two companies is expected to create globally competitive products by considering AI models for AI semiconductors while designing.

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