Skip to content

SKC Buys Stake in Chipletz: The Future of Semiconductor Packaging

Source: Chipletz

Seoul, South Korea - SKC Co (KRX: 011790) is partnering with Austin-based Chipletz, a semiconductor packaging startup.

Why it matters:

As the semiconductor industry grows, how chips are packaged becomes critical.

Partnerships like SKC's with Chipletz could influence the direction of semiconductor technology development.

The Key Points

  • SKC is expected to hold an approximately 12% stake in Chipletz after the Series B funding round. Details of the investment are being kept under wraps due to confidentiality clauses.
  • Chipletz, originally spun out of Advanced Micro Devices Inc.(AMD) in 2016, will become independent in 2021. Its primary technology, known as smart substrates, supports the integration of different die makers.
  • Chipletz's notable shareholders include AMD and ASE, a Taiwan-based company that specializes in chip assembly.
  • SKC's recent efforts include the $400 million acquisition of a 45% stake in ISC Co, a semiconductor test socket manufacturer, and the purchase of U.S.-based Absolics Inc., which has a $600 million fab project underway in Georgia.

The Big Picture

Semiconductor packaging is the final step in semiconductor manufacturing, bonding chips to circuit boards and protecting the semiconductor components.

As continued chip capacity growth becomes challenging, alternative packaging methods are gaining momentum.

Glass substrates, or thin layers of glass for mounting memory chips, offer a way to increase chip performance and energy efficiency.

SKC's forward-looking strategies include more than KRW 5 trillion investments in secondary batteries, semiconductors, and sustainable products.

They forecast sales to reach KRW 7.9 trillion in 2025 and grow to KRW 11 trillion by 2027.

By joining forces with Chipletz, SKC strengthens its global presence in semiconductor post-processing.

The combination of Chipletz's design expertise and SKC's manufacturing capabilities sets the stage for potential disruption in the semiconductor post-processing industry.