SK Hynix Starts Mass Production of HBM3E Memory for AI

Seoul, South Korea - SK Hynix (KRX: 000660) announced that it has started volume production of HBM3E, the industry's first high-bandwidth memory product with enhanced performance for artificial intelligence (AI) applications. 

The company began shipping the new memory to a customer in late March, just seven months after announcing its development.

The HBM3E is an extension of the HBM3 memory that SK Hynix successfully introduced earlier. 

The company expects the mass production of HBM3E to strengthen its position as a global leader in AI memory technology. 

As AI systems require rapidly processing large amounts of data, major technology companies have been demanding high-performance memory solutions.

SK Hynix's HBM3E boasts industry-leading specifications, including a data processing speed of up to 1.18 terabytes per second, equivalent to processing more than 230 full HD movies (5GB each) in a single second. 

The product also features a 10% improvement in heat dissipation over its predecessor due to the advanced MR-MUF (Mass Reflow Molded Underfill) process.

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