LG Debuts AIDC Cooling & DC Grid Tech at DCW 2026

Washington, D.C. — LG Electronics presented cooling and power infrastructure systems for artificial intelligence data centers at the 2026 Data Center World conference in Washington, D.C.

The technology on display ranged from direct-to-chip cooling hardware to facility-wide power management software.

The company detailed its direct-to-chip liquid cooling line, designed for high-thermal-density AI workloads.

The system includes a cold plate with a skived fin structure and a 1.4-megawatt coolant distribution unit equipped with inverter-driven pumps.

For high-heat environments, LG displayed immersion cooling tanks developed with U.S.-based Green Revolution Cooling, using dielectric cooling fluids developed in partnership with SK Enmove.

Facility-level infrastructure on display included a computer room air handler using EC fans and an air-cooled centrifugal chiller.

These hardware components integrate with LG's data center cooling management software, which provides 3D visualization, virtual sensor diagnostics, and predictive maintenance based on IT workloads.

LG also introduced an AI-based workload orchestration platform developed by PADO, an LG NOVA spin-off.

The platform uses a multi-physics digital twin and reinforcement learning to redirect power from idle servers to those handling heavy AI workloads, which the company states can increase utilization by 25 percent.

LG also exhibited a direct current grid solution developed in collaboration with LS ELECTRIC, LS Cable & System, and LG Energy Solution.

By allowing major equipment, such as chillers, to operate directly on DC power, the system reduces initial power conversion losses to approximately 15 percent, compared with the typical 25 percent lost in standard alternating current systems.

According to LG, that figure can drop to 10 percent when the system is integrated with solar power.

The exhibition at the Walter E. Washington Convention Center runs through April 23.