Seoul, South Korea / Taipei, Taiwan—SK Hynix (KRX: 000660) has signed a Memorandum of Understanding (MoU) with Taiwan Semiconductor Manufacturing Company (TSMC, TPE: 2330) to jointly develop the next generation of High-Bandwidth Memory (HBM) and improve the integration of logic and HBM through advanced packaging technology.
The collaboration aims to produce HBM4, the sixth generation of the HBM family, by 2026.
The partnership between SK Hynix and TSMC, a leading global logic foundry, is expected to drive innovation in HBM technology and push the boundaries of memory performance for AI applications through a three-way collaboration between product designer, foundry, and memory provider.
The companies will focus on improving the performance of the base die, which is located at the bottom of the HBM package and connected to the GPU that controls the HBM.
SK Hynix plans to adopt TSMC's advanced logic process for the HBM4's base die. This process enables additional functionality in a limited space and the production of customized HBM solutions that meet a wide range of customer requirements for performance and power efficiency.
The companies also agreed to optimize the integration of SK Hynix's HBM and TSMC's CoWoS (Chip on Wafer on Substrate) packaging technology.
Under the agreement, SK Hynix will utilize TSMC's advanced logic process for the HBM4 base die, enabling additional functionality in a limited space and the production of customized HBM solutions to meet a wide range of customer requirements.
The companies will also work together to optimize the integration of SK Hynix's HBM and TSMC's CoWoS (Chip on Wafer on Substrate) packaging technology.
