Samsung-AMD Partner on Advanced Data Center Substrates

Seoul, South Korea - Samsung Electro-Mechanics (SEMCO) announced a collaboration with Advanced Micro Devices (AMD) to supply high-performance substrates for hyperscale data center computing applications.

The substrates will be manufactured at SEMCO's technology hub in Busan and its new factory in Vietnam.

The collaboration addresses challenges in integrating multiple semiconductor chips on a single large substrate for CPU/GPU applications. 

These substrates offer larger surface areas and higher layer counts than standard computer substrates.

SEMCO's manufacturing processes aim to mitigate issues like warpage to ensure high yields during chip mounting.

The company has invested 1.9 trillion KRW in its FCBGA factory, which features advanced real-time data collection and modeling capabilities.

Kim Wontaek, Executive Vice President at SEMCO, said investing in advanced substrate solutions will provide key value to customers like AMD.

Scott Aylor, Corporate VP at AMD, stated that the partnership with SEMCO supports AMD's efforts to deliver future generations of high-performance computing and AI products.

Market research firm Prismark predicts the semiconductor substrate market will grow at an average annual rate of about 7%, reaching KRW 20 trillion by 2028.