SK Hynix to Unveil AI Memory Tech Suite at CES 2025

Las Vegas, NV—SK Hynix Inc. announced that it will present its latest artificial intelligence memory technologies at the Consumer Electronics Show (CES) 2025 in Las Vegas from January 7 to 10.

The company will display samples of its recently developed HBM3E 16-layer products. 

These products utilize advanced MR-MUF process technology to achieve maximum heat dissipation while controlling chip warpages.

SK Hynix will exhibit its enterprise solid-state drive (SSD) products, including the D5-P5336 122TB model developed by its subsidiary Solidigm, in November 2024. 

In December, the company also developed QLC-based 61TB products.

The semiconductor manufacturer plans to showcase on-device AI products such as LPCAMM2 and ZUFS 4.0. 

LPCAMM2 isana LPDDR5X-based module solution that can replace two DDR5 SODIMMs while maintaining power efficiency and high performance. 

ZUFS 4.0 optimizes data transfer between operating systems and storage devices by storing similar data characteristics in the same zone.

The company will present CXL and Processing in Memory (PIM) technologies and modularized versions of CMM-Ax and AiMX. 

The CMM-Ax adds computational functionality to CXL's high-capacity memory expansion capabilities.

SK Hynix CEO Kwak No-jung said the company will begin production of 6th generation HBM (HBM4) in the second half of 2025 to address diverse customer needs in the customized HBM market.