Samsung Begins Mass Production of Ultra-Thin LPDDR5X DRAM

Seoul, South Korea - Samsung Electronics (005930. KS) has started mass production of what it claims are the industry's thinnest 12-nanometer (nm)-class, 12-gigabyte (GB) and 16GB LPDDR5X DRAM packages.

The new DRAM packages measure 0.65 millimeters in height, about 9% thinner than the previous generation. 

Samsung says this reduction allows for better thermal control in mobile devices, particularly for applications using on-device artificial intelligence.

The South Korean tech giant achieved this by stacking four layers of 12nm-class DRAM die and optimizing printed circuit board and epoxy molding compound techniques.

The company claims the new packages also offer about 21.2% improved heat resistance compared to their predecessors.

YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics, said the DRAM "sets a new standard for high-performance on-device AI solutions."

Samsung plans to supply the 0.65mm LPDDR5X DRAM to mobile processor makers and device manufacturers. 

The company also announced plans to develop even denser modules, including 6-layer 24GB and 8-layer 32GB versions, to meet the growing demand for high-performance, high-density mobile memory solutions in smaller package sizes.

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